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William Clark, President
Spindle, Inc.
Wednesday, January 29, 2014
9:15 - 9:45am
William (Bill) Clark has 25 years of experience in business operations, sales, marketing and product development in the payments industry, with many successful releases of new payment technologies and products. Prior to joining Spindle, Mr. Clark was Executive VP and General Manager for Apriva LLC where he led the North American operations for this mobile payments technology company. Mr. Clark was responsible for the strategic direction and execution of Apriva's national marketing initiatives, sales teams, client/customer services and product management, serving 350 reseller channels.
For more information on William Clark click here.
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Siva Narendra, Co-Founder and CEO,Tyfone
Thursday, January 30, 2014
9:15 - 9:45am
Siva is co-founder and CEO of Tyfone, responsible for Tyfone’s product architecture, roadmap and IP. Before his current responsibility, he was with Intel Laboratories specializing in energy and yield aware designs. He has authored over 60 technical papers in peer reviewed conferences and journals, and frequently lectures on technology forums. He also has over 100 issued/pending patents and holds five divisional recognition awards from Intel and an award in 2003 for having 19 issued patents in that year.
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